CN

Stock Code:800328

QINGDAO JIAEN SEMICONDUCTOR CO., LTD

  • IGBT parallel technology-IGBT current sharing problem
    2024.05.11

    IGBT parallel technology-IGBT current sharing problem

    Factors affecting static current sharing 1. The resistance component of the DC bus side connection point of the parallel IGBT needs to be as symmetrical as possible; 2. There is a difference between the Vce(sat) of the IGBT chip and the VF of the diode chip, so try to use products from the same batch. 3. The temperature difference between the IGBT modules needs to be considered when designing the mechanical structure and air duct; 4. Differences in magnetic fields where IGBT modules are located; 5. The difference in gate voltage Vge.

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  • What are the substrate requirements for heteroepitaxial growth?
    2024.04.17

    What are the substrate requirements for heteroepitaxial growth?

    Heteroepitaxy is an advanced crystal growth technology. It refers to the process of growing a thin film or epitaxial layer with a different crystal structure or chemical composition from the substrate material on a specific substrate material, that is: on a specific substrate material. A substrate of material grows on another material.

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  • IGBT module peak voltage absorption circuit
    2024.04.09

    IGBT module peak voltage absorption circuit

    When the IGBT is turned off, a surge voltage will occur between the collector and the emitter due to the energy stored in the inductor. The snubber circuit suppresses overvoltage applied to the IGBT and increases turn-off losses. This is because the snubber capacitor can share part of the energy during shutdown. Be sure to handle the energy absorbed by the capacitor properly.

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  • The concept of IGBT driver isolation
    2024.03.27

    The concept of IGBT driver isolation

    What is quarantine? Galvanic isolation: Charge cannot move from one circuit to another, and signals from both parties exchange information through other means.

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  • THE PACKAGING AND TESTING INDUSTRY RESHUFFLE IS ACCELERATING, AND MAINLAND MANUFACTURERS ARE FACING NEW OPPORTUNITIES
    2024.03.21

    THE PACKAGING AND TESTING INDUSTRY RESHUFFLE IS ACCELERATING, AND MAINLAND MANUFACTURERS ARE FACING NEW OPPORTUNITIES

    Recently, the packaging and testing industry in mainland China has been undergoing a lot of changes.

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  • Analysis of IGBT switching process and driving considerations
    2024.03.15

    Analysis of IGBT switching process and driving considerations

    The circuit of IGBT under diode clamped inductive load conditions is shown in Figure 1. This circuit is a commonly used IGBT circuit and can be used as a test circuit for IGBT switching characteristics to evaluate the on and off behavior of IGBT. Figure 2 shows the actual IGBT switch waveform obtained by comprehensively considering the recovery characteristics of diodes and stray inductance (Ls), which can be used as a reference for designing IGBT drive circuits. Firstly, we set the IGBT to operate under continuous steady-state current conditions, flowing through an inductive load and then through an ideal freewheeling diode parallel to the inductive load.

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