Functional ceramics in IGBT is equivalent to the application on electronic circuit substrates. As the material of functional ceramic substrates, it has excellent insulation. Next, I will introduce the application of functional ceramics in the field of IGBTs.
IGBT is an insulated gate bipolar transistor, which is a composite fully controlled voltage-driven power semiconductor device composed of BJT and MOS. The driving power is small and the saturation voltage is reduced. It is very suitable for converter systems with DC voltage of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits, traction drives, etc. IGBT is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices, and is widely used in household appliances, rail transit, smart grid, aerospace, electric vehicles and new energy equipment.
So what is the application of functional ceramics in IGBT?
With the rapid development of new energy vehicles, high-speed rail, wind power generation and 5G base stations, the high-power IGBTs used in these new industries have a huge demand for a new generation of high-strength aluminum nitride functional ceramic substrates. The heat generated by the high-voltage and high-power IGBT module is mainly dissipated through the functional ceramic CCL to the casing. Therefore, the functional ceramic CCL is an indispensable key basic material for power module packaging in the power electronics field.
At present, there are three types of ceramics that have been used as functional ceramic CCL substrate materials, namely alumina functional ceramic substrate, aluminum nitride functional ceramic substrate and silicon nitride functional ceramic substrate. Alumina functional ceramic substrate is the most commonly used functional ceramic substrate, which has good insulation, chemical stability, mechanical properties and low price, but due to the relatively low thermal conductivity of alumina functional ceramic substrate and the thermal expansion of silicon The coefficient matching is not good, and it is not suitable as a high-power module packaging material. The aluminum nitride functional ceramic substrate has very high thermal conductivity in terms of thermal characteristics, and heat dissipation is fast; in terms of stress, the thermal expansion coefficient is close to that of silicon, and the internal stress of the entire module is low, which improves the reliability of high-voltage IGBT modules. These excellent properties make aluminum nitride copper clad laminates the first choice for high-voltage IGBT module packaging.
The advantages of aluminum nitride functional ceramic copper clad laminate?
Aluminum nitride functional ceramic CCL not only has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength and low expansion of ceramics, but also has high electrical conductivity and excellent welding performance of oxygen-free copper, which is the key to IGBT module packaging. base material.
Aluminum nitride functional ceramic copper clad laminate combines various advantages of power electronic packaging materials:
1) The ceramic part has excellent thermal conductivity and pressure resistance;
2) The copper conductor part has extremely high current carrying capacity;
3) High adhesion strength and reliability between metal and ceramics;
4) It is easy to etch patterns and form circuit substrates;
5) Excellent welding performance, suitable for aluminum wire bonding.
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